The simulation of thermomechanically induced stress in plastic encapsulated IC packages /
Gerard Kelly.
| Main Creator: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published / Created: |
Boston :
Kluwer Academic Publishers,
1999.
|
| Subjects: | |
| Notes: | Includes bibliographical references and index. Physical description: xix, 134 p. : ill. ; 25 cm. more |
| ISBN: | 0792384857 (hbk.) |
| LEADER | 01139cam a2200301 a 4500 | ||
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| 100 | 1 | |a Kelly, Gerard, |c Dr. | |
| 245 | 1 | 4 | |a The simulation of thermomechanically induced stress in plastic encapsulated IC packages / |c Gerard Kelly. |
| 260 | |a Boston : |b Kluwer Academic Publishers, |c 1999. | ||
| 300 | |a xix, 134 p. : |b ill. ; |c 25 cm. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 650 | 0 | |a Microelectronic packaging | |
| 650 | 0 | |a Integrated circuits |x Materials |x Stress corrosion | |
| 650 | 0 | |a Electronic apparatus and appliances |x Plastic embedment | |
| 650 | 0 | |a Integrated circuits |x Materials |x Thermomechanical properties | |
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