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The simulation of thermomechanically induced stress in plastic encapsulated IC packages /

Gerard Kelly.
Main Creator: Kelly, Gerard, Dr.
Format: BOOK
Language:English
Published / Created: Boston : Kluwer Academic Publishers, 1999.
Subjects:
Notes:Includes bibliographical references and index.

Physical description: xix, 134 p. : ill. ; 25 cm.

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ISBN:0792384857 (hbk.)
Call Number View In Collection
A27217
Main Reading Room
Irish