Holdings: The simulation of thermomechanically induced stress in plastic encapsulated IC packages /

Main Creator:	Kelly, Gerard, Dr.
Format:	BOOK
Language:	English
Published / Created:	Boston : Kluwer Academic Publishers, 1999.
Subjects:	Microelectronic packaging Integrated circuits > Materials > Stress corrosion Electronic apparatus and appliances > Plastic embedment Integrated circuits > Materials > Thermomechanical properties
Notes:	Includes bibliographical references and index. Physical description: xix, 134 p. : ill. ; 25 cm. more
ISBN:	0792384857 (hbk.)

Call Number	View In	Collection
A27217	Main Reading Room	Irish